DocumentCode :
2698754
Title :
Temperature assessment of AlGaN/GaN HEMTs: A comparative study by Raman, electrical and IR thermography
Author :
Killat, N. ; Kuball, M. ; Chou, T. -M ; Chowdhury, U. ; Jimenez, J.
Author_Institution :
H.H. Wills Phys. Lab., Univ. of Bristol, Bristol, UK
fYear :
2010
fDate :
2-6 May 2010
Firstpage :
528
Lastpage :
531
Abstract :
The accuracy of different thermography techniques for the determination of AlGaN/GaN HEMT channel temperature was investigated. Micro-Raman thermography, a novel electrical testing method, and IR thermography were applied to measure the temperature in the active region of AlGaN/GaN HEMTs with different device geometries. Due to its accepted accuracy, micro-Raman thermography was performed on different devices in order to validate thermal simulation results. When compared to the validated thermal model, pulsed I-V measurements underestimated channel temperature to some degree, while IR thermography determined unrealistically low device temperatures.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; infrared imaging; temperature measurement; testing; wide band gap semiconductors; AlGaN-GaN; HEMT channel temperature; IR thermography; Raman thermography; device geometries; electrical testing method; electrical thermography; microRaman thermography; pulsed I-V measurement; temperature assessment; thermal simulation; Aluminum gallium nitride; Electric variables measurement; Gallium nitride; HEMTs; Laboratories; MODFETs; Pulse measurements; Raman scattering; Temperature measurement; Thermal management; HEMT; device reliability; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4244-5430-3
Type :
conf
DOI :
10.1109/IRPS.2010.5488777
Filename :
5488777
Link To Document :
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