A failure levels study of non-snapback ESD devices for automotive applications

Snapback ESD devices suffer from increasing danger when the protected ICs experience ESD events in powered up states. To ensure more reliable ESD protections, non-snapback ESD structures are gaining more importance in the field of automotive ESD design. Two types of on-chip non-snapback ESD devices, pn-diodes and active FET structures are investigated in this work regarding their failure levels. Characteristics of the ESD devices as well as electrical SOA of an nLDMOS are evaluated and discussed in detail with TCAD electro-thermal simulation, SPICE circuit simulation and mainly TLP measurements. Comparison of the efficiency of different ESD protections considering ESD window is also given, delivering the basic idea of choosing the right ESD devices in automotive applications.