• DocumentCode
    2699182
  • Title

    Validated electromagnetic coupling predictions for an electronic subsystem based on the finite-element time-domain method

  • Author

    Riley, Douglas ; Sower, Gary ; Schafer, David ; Baca, Gerald

  • Author_Institution
    Northrop Grumman Corp., Albuquerque, NM
  • fYear
    2006
  • fDate
    9-14 July 2006
  • Firstpage
    2789
  • Lastpage
    2792
  • Abstract
    The finite-element time-domain (FETD) method is used to predict electromagnetic coupling into an electronic subsystem. Accurately predicting coupling into electronics systems is challenging because small changes to geometry and materials can significantly shift the frequencies at which resonances and nulls occur. The test object consisted of two metal chassis, a variety of apertures, an unshielded wire, multipin connectors, Eccosorbtrade RF absorptive sheets, and circuit boards. Experimental validation is provided over a frequency range of 0.5 GHz to 3 GHz. The experimental response of the test object was based on illumination by a double ridge horn antenna at distances of 1 m and 7.5 m, whereas the predictions were based on free-field, plane-wave excitation. Good correlation between measurements and predictions for the amplitude and trend of the coupling data is established down to the circuit-trace level
  • Keywords
    electromagnetic coupling; finite element analysis; horn antennas; time-domain analysis; 0.5 to 3 GHz; Eccosorb RF absorptive sheets; circuit boards; circuit-trace level; double ridge horn antenna; electronic subsystem; finite-element time-domain method; free-field plane-wave excitation; metal chassis; multipin connectors; unshielded wire; validated electromagnetic coupling predictions; Apertures; Circuit testing; Coupling circuits; Electromagnetic coupling; Finite element methods; Geometry; Resonance; Resonant frequency; Sheet materials; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium 2006, IEEE
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    1-4244-0123-2
  • Type

    conf

  • DOI
    10.1109/APS.2006.1711184
  • Filename
    1711184