DocumentCode :
2699353
Title :
Accumulation mode transistors for silicon-on-insulator circuits
Author :
MacElwee, T.W. ; Calder, I.D.
Author_Institution :
Northern Telecom Electron. Ltd., Ottawa, Ont., Canada
fYear :
1989
fDate :
3-5 Oct 1989
Firstpage :
171
Lastpage :
172
Abstract :
Summary form only given. Devices and circuits fabricated on thin fully depleted (FD) silicon-on-insulator (SOI) substrates should provide very high levels of performance for submicron circuits. The fully depleted transistor offers several advantages such as no kink effect, a reduction in the impact ionization effects and short-channel effects normally found in thick-film and bulk devices. In addition fully depleted transistors offer high carrier mobilities and an increase in transconductance. To obtain even higher performance particularly with respect to the P-channel transistor, an accumulation mode (AM) device has been used. The Operation of this device depends on the formation of an accumulation layer under the gate, as opposed to an inversion layer. Two-dimensional modeling and experimental data indicate that the AM transistor is a favored device for use in ULSI SOI circuits
Keywords :
CMOS integrated circuits; VLSI; accumulation layers; insulated gate field effect transistors; ion implantation; semiconductor device models; semiconductor-insulator boundaries; AM transistor; CMOS circuits; MOSFET; SIMOX; Si on insulator circuits; Si:O; ULSI SOI circuits; accumulation mode transistors; carrier mobilities; fully depleted transistor; impact ionization effects; kink effect; short-channel effects; submicron circuits; transconductance; two dimensional modelling; Circuits; Crystallization; Electrons; MOSFETs; Semiconductor films; Silicon on insulator technology; Substrates; Temperature; Transconductance; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOS/SOI Technology Conference, 1989., 1989 IEEE
Conference_Location :
Stateline, NV
Type :
conf
DOI :
10.1109/SOI.1989.69818
Filename :
69818
Link To Document :
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