DocumentCode :
2699444
Title :
A new library for PolyMEMS-INAOE process
Author :
Tovar, Fidel Wilivaldo Pérez ; de Rivera y Oyarzabal, Luis Niño ; Arriaga, Wilfrido Calleja
Author_Institution :
SEPI ESIME Culhuacan, Inst. Politec. Nac. (IPN), Mexico City, Mexico
fYear :
2011
fDate :
26-28 Oct. 2011
Firstpage :
1
Lastpage :
5
Abstract :
MEMS design systems is usually supported by specialized MEMS CAD software that helping designers targeting of specific process technologies to ensure process compatibility and manufacturability with manufactures MEMS. MEMS CAD tools, among others, include Manufactures design rules, mask layers description, device descriptions for extraction, process parameters, material properties, and fabrication process descriptions. We discuss in this paper the design of a new library that includes the rules of the first Mexican manufactures PolyMEMS-INAOE. The PolyMEMS-INAOE offers a three polysilicon layer processes, the main rules are discussed and integrated to a commercial MEMS CAD software, MEMS Pro. The discussion presented in this paper will help PolyMEMS-INAOE users to integrate those rules to any other MEMS CAD software.
Keywords :
CAD; electronic engineering computing; masks; micromachining; micromechanical devices; surface treatment; MEMS CAD software; MEMS CAD tool; MEMS Pro; MEMS design system; Mexican manufactures PolyMEMS-INAOE; PolyMEMS-INAOE process library; device description; fabrication process description; manufacturability; manufacture design rules; mask layer description; material properties; polysilicon layer process; process compatibility; process parameters; process technology; surface micromachining; Design automation; Fabrication; Materials; Metals; Micromechanical devices; Passivation; Software; MEMS CAD; MEMS design rules; PolyMEMS-INAOE;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Engineering Computing Science and Automatic Control (CCE), 2011 8th International Conference on
Conference_Location :
Merida City
Print_ISBN :
978-1-4577-1011-7
Type :
conf
DOI :
10.1109/ICEEE.2011.6106660
Filename :
6106660
Link To Document :
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