Title :
X-ray computed tomography for non-destructive failure analysis in microelectronics
Author :
Pacheco, Mario ; Goyal, Deepak
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
In this paper a review of the development of x-ray computed tomography (CT) for non-destructive failure analysis in microelectronics is presented. The general operation principle, key design considerations and technical challenges faced by x-ray CT technology are discussed. A comparison between 2D and 3D x-ray imaging capabilities is presented, and critical failure analysis case studies that are hard or not possible to isolate by alternative methods are also discussed, as well as its unique progressive testing capability.
Keywords :
X-ray imaging; X-ray microscopy; computerised tomography; failure analysis; integrated circuit reliability; X-ray computed tomography; X-ray imaging capabilities; general operation principle; microelectronics; nondestructive failure analysis; progressive testing capability; Assembly; Computed tomography; Failure analysis; Image analysis; Image resolution; Microelectronics; Testing; X-ray detection; X-ray detectors; X-ray imaging;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-5430-3
DOI :
10.1109/IRPS.2010.5488820
