DocumentCode
2700035
Title
Reliability study of bilayer graphene - material for future transistor and interconnect
Author
Yu, Tianhua ; Lee, Eun-Kyu ; Briggs, Benjamin ; Nagabhirava, Bhaskar ; Yu, Bin
Author_Institution
Coll. of Nanoscale Sci. & Eng., Univ. at Albany, State Univ. of New York, Albany, NY, USA
fYear
2010
fDate
2-6 May 2010
Firstpage
80
Lastpage
83
Abstract
Graphene is considered to be promising candidate for future transistor and interconnects material in integrated circuits because of its high intrinsic mobility and current-carrying capacity outperforming Cu. Particularly, bilayer graphene (BLG) systems offer controllable and wide band gap tunability without the need for nontrivial atomically precise nanoribbon patterning, which is indispensable to band gap engineering of monolayer graphene. Hence, novel devices consisting of BLG as both transistors and interconnects in combination with well-established Cu interconnects is conceivable. In this frame, this study has aimed to address reliability limiting factors of BLG/Cu contacts and current-carrying capacity.
Keywords
copper; graphene; integrated circuit interconnections; transistors; Cu; bilayer graphene; bilayer graphene systems; current-carrying capacity; high intrinsic mobility; integrated circuits; interconnects material; nontrivial atomically precise nanoribbon patterning; reliability limiting factors; transistors; wide band gap tunability; Annealing; Contact resistance; Copper; Electric breakdown; Electric resistance; Fabrication; Integrated circuit interconnections; Materials reliability; Testing; Thermal conductivity; Bilayer graphene; breakdown; contact; current annealing; interconnect;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-5430-3
Type
conf
DOI
10.1109/IRPS.2010.5488851
Filename
5488851
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