DocumentCode :
2700097
Title :
Fabrication and characterization of N-face AlGaN/GaN/AlGaN HEMTs
Author :
Chini, A. ; Rajan, S. ; Wong, M. ; Fu, Y. ; Speck, J.S. ; Mishra, U.K.
Author_Institution :
Dipt. di Ingegneria dell´´Informazione, Univ. di Modena
Volume :
1
fYear :
2005
fDate :
22-22 June 2005
Firstpage :
63
Lastpage :
64
Abstract :
The paper reports on the characteristics of N-face AlGaN/GaN/AlGaN HEMTs. Ohmic contact optmization experiments based on the Ti/Al/Ni/Au metallization scheme commonly used for Ga-face AlGaN/GaN HEMTs were carried out and a low contact resistance of 1.3 Ohm/mm was achieved. The devices were then characterized before and after SiN passivation. Before passivation, large current dispersion was observed in 80mus pulsed I-V measurements compare to the DC I-V curves. The adoption of a SiN passivation layer improved the I-V pulsed characteristics at 80mus but current dispersion was still severe when using shorter (200ns) pulse widths
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; ohmic contacts; passivation; semiconductor device metallisation; silicon compounds; wide band gap semiconductors; 1.3 ohm; AlGaN-GaN-AlGaN; HEMT; SiN; current dispersion; high electron mobility transistors; ohmic contact optimization; passivation layer; Aluminum gallium nitride; Fabrication; Gallium nitride; HEMTs; MODFETs; Ohmic contacts; Passivation; Pulse measurements; Silicon compounds; Space vector pulse width modulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference Digest, 2005. DRC '05. 63rd
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-9040-7
Type :
conf
DOI :
10.1109/DRC.2005.1553056
Filename :
1553056
Link To Document :
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