• DocumentCode
    2700672
  • Title

    Effect of anodic interface layers on the unipolar switching of HfO2-based resistive RAM

  • Author

    Wang, X.P. ; Chen, Y.Y. ; Pantisano, L. ; Goux, L. ; Jurczak, M. ; Groeseneken, G. ; Wouters, D.J.

  • Author_Institution
    IMEC vzw, Leuven, Belgium
  • fYear
    2010
  • fDate
    26-28 April 2010
  • Firstpage
    140
  • Lastpage
    141
  • Abstract
    In this work, the effect of the anode electrode-HfO2 interface on unipolar switching for HfO2-based RRAM is systematically investigated. It is found that the switching behavior can be improved not only by changing the anode electrode material (TiN vs. Pt), but also by engineering the anodic interface with thin M or MOx capping layers between the electrode and the HfO2 film, such as Ti or TiO. The relative stability of oxide formation, as expressed by the thermodynamic parameter, ΔfG (molar Gibbs energy of oxide formation), is introduced in this work to understand those different switching behaviors more directly.
  • Keywords
    hafnium compounds; random-access storage; titanium compounds; HfO2; TiN; anode electrode material; anodic interface layers; molar Gibbs energy; oxide formation; relative stability; resistive RAM; resistive random access memory; thermodynamic parameter; unipolar switching; Anodes; Bonding; Degradation; Electrodes; Hafnium oxide; Power engineering and energy; Thermal stability; Thermodynamics; Tin; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-5063-3
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2010.5488914
  • Filename
    5488914