DocumentCode
2700672
Title
Effect of anodic interface layers on the unipolar switching of HfO2 -based resistive RAM
Author
Wang, X.P. ; Chen, Y.Y. ; Pantisano, L. ; Goux, L. ; Jurczak, M. ; Groeseneken, G. ; Wouters, D.J.
Author_Institution
IMEC vzw, Leuven, Belgium
fYear
2010
fDate
26-28 April 2010
Firstpage
140
Lastpage
141
Abstract
In this work, the effect of the anode electrode-HfO2 interface on unipolar switching for HfO2-based RRAM is systematically investigated. It is found that the switching behavior can be improved not only by changing the anode electrode material (TiN vs. Pt), but also by engineering the anodic interface with thin M or MOx capping layers between the electrode and the HfO2 film, such as Ti or TiO. The relative stability of oxide formation, as expressed by the thermodynamic parameter, ΔfG (molar Gibbs energy of oxide formation), is introduced in this work to understand those different switching behaviors more directly.
Keywords
hafnium compounds; random-access storage; titanium compounds; HfO2; TiN; anode electrode material; anodic interface layers; molar Gibbs energy; oxide formation; relative stability; resistive RAM; resistive random access memory; thermodynamic parameter; unipolar switching; Anodes; Bonding; Degradation; Electrodes; Hafnium oxide; Power engineering and energy; Thermal stability; Thermodynamics; Tin; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
978-1-4244-5063-3
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2010.5488914
Filename
5488914
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