• DocumentCode
    2700767
  • Title

    Hole band anisotropy effect on ON-state performance of biaxial compressive strained SiGe-based short channel QW pMOSFETs: Experimental observations

  • Author

    Lee, Se-Hoon ; Nainani, Aneesh ; Oh, Jungwoo ; Kirsch, Paul ; Banerjee, Sanjay K. ; Jammy, R.

  • Author_Institution
    Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2010
  • fDate
    26-28 April 2010
  • Firstpage
    126
  • Lastpage
    127
  • Abstract
    Quantum well (QW) FETs with compressively-strained SiGe channel are promising candidates for pMOSFET for future logic technology with scaled operating voltage. High hole mobility observed in strained SiGe channel layer, as compared to Si, is expected to result in enhanced performance of these devices for deep submicron channel lengths. However, most of experimental results in literature so far, focusing on [011] channel direction on relaxed (100) Si bulk substrate have shown mobility degradation (hence drive current degradation) or marginal drive current enhancement at short channel regime in pseudomorphic SiGe based channels over Si control. This has been attributed to effects of additional Coulomb scattering (from Nit and halo) and from neutral defects, as shown in Fig. 1. While these are indeed additional source of defects over Si counterpart inhibiting performance enhancement, highly anisotropic hole band structure with biaxial compressive strained SiGe channel could also play an important role on the ON-state performance degradation especially in deep submicron regime. In this paper we investigate the channel orientation dependence on the performance in an optimized Si0.5Ge0.5 QW channel. Strong drive current (mobility) enhancement is observed in [010] versus [011]. This directional dependence is further amplified at shorter channel lengths and lower temperature, and is explained on the basis of anisotropy in band structure.
  • Keywords
    Ge-Si alloys; MOSFET; quantum well devices; Coulomb scattering; ON-state performance; Si0.5Ge0.5; anisotropic hole band structure; biaxial compressive strained channel; channel orientation dependence; deep submicron channel lengths; hole band anisotropy effect; logic technology; marginal drive current enhancement; mobility degradation; scaled operating voltage; short channel quantum well pMOSFET; Anisotropic magnetoresistance; Degradation; FETs; Germanium silicon alloys; Logic devices; MOSFETs; Particle scattering; Silicon germanium; Temperature dependence; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-5063-3
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2010.5488920
  • Filename
    5488920