DocumentCode
2700961
Title
Trace Element Effect On Tin-lead (60%-40%) Solder Wetting
Author
Wu, Nianzu
fYear
1993
fDate
9-11 Jun 1993
Firstpage
62
Lastpage
65
Keywords
Copper; Electronics industry; Gallium alloys; Gallium compounds; Impurities; Ovens; Production facilities; Surface cleaning; Surface treatment; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639348
Filename
639348
Link To Document