DocumentCode :
2701090
Title :
Evaluation of conductivity for the under side section of various types of copper-clad dielectric substrates using a whispering gallery mode resonator
Author :
Huong, Tran Thi ; Kai, Takafumi ; Hirokawa, Jiro ; Kogami, Yoshinori ; Ando, Makoto
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol.
fYear :
2006
fDate :
9-14 July 2006
Firstpage :
3199
Lastpage :
3202
Abstract :
In this paper, the conductivity of a copper-clad cyclo olefin polymer (COP) substrate and PTFE substrates with two types of copper clad in the millimeter wave region was accurately evaluated. The roughness of the contact between the copper and dielectric could degrade the conductivity of the copper equivalently, which increases loss. The evaluation of complex permittivity in a dielectric substrate without copper was first conducted by using an open type WG mode resonator. Then the conductivity was estimated for the under side section of the substrate based upon the obtained complex permittivity by using a copper-clad type WG mode resonator. The conductivity was successfully measured for different copper-clad
Keywords :
claddings; copper; dielectric materials; dielectric resonators; electrical conductivity; millimetre wave measurement; permittivity; substrates; whispering gallery modes; PTFE substrate; complex permittivity; conductivity evaluation; contact roughness; copper-clad cyclo olefin polymer substrate conductivity; copper-clad dielectric substrates; copper-clad type WG mode resonator; millimeter wave region; open type WG mode resonator; under side section; whispering gallery mode resonator; Conductivity; Copper; Dielectric materials; Dielectric measurements; Dielectric substrates; Electromagnetic waveguides; Millimeter wave technology; Permittivity measurement; Wavelength measurement; Whispering gallery modes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium 2006, IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
1-4244-0123-2
Type :
conf
DOI :
10.1109/APS.2006.1711291
Filename :
1711291
Link To Document :
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