• DocumentCode
    2701090
  • Title

    Evaluation of conductivity for the under side section of various types of copper-clad dielectric substrates using a whispering gallery mode resonator

  • Author

    Huong, Tran Thi ; Kai, Takafumi ; Hirokawa, Jiro ; Kogami, Yoshinori ; Ando, Makoto

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol.
  • fYear
    2006
  • fDate
    9-14 July 2006
  • Firstpage
    3199
  • Lastpage
    3202
  • Abstract
    In this paper, the conductivity of a copper-clad cyclo olefin polymer (COP) substrate and PTFE substrates with two types of copper clad in the millimeter wave region was accurately evaluated. The roughness of the contact between the copper and dielectric could degrade the conductivity of the copper equivalently, which increases loss. The evaluation of complex permittivity in a dielectric substrate without copper was first conducted by using an open type WG mode resonator. Then the conductivity was estimated for the under side section of the substrate based upon the obtained complex permittivity by using a copper-clad type WG mode resonator. The conductivity was successfully measured for different copper-clad
  • Keywords
    claddings; copper; dielectric materials; dielectric resonators; electrical conductivity; millimetre wave measurement; permittivity; substrates; whispering gallery modes; PTFE substrate; complex permittivity; conductivity evaluation; contact roughness; copper-clad cyclo olefin polymer substrate conductivity; copper-clad dielectric substrates; copper-clad type WG mode resonator; millimeter wave region; open type WG mode resonator; under side section; whispering gallery mode resonator; Conductivity; Copper; Dielectric materials; Dielectric measurements; Dielectric substrates; Electromagnetic waveguides; Millimeter wave technology; Permittivity measurement; Wavelength measurement; Whispering gallery modes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium 2006, IEEE
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    1-4244-0123-2
  • Type

    conf

  • DOI
    10.1109/APS.2006.1711291
  • Filename
    1711291