DocumentCode :
2701270
Title :
Layered HfSiON-based tunnel stacks for voltage reduction and improved reliability in TANOS memories
Author :
Molas, G. ; Bocquet, M. ; Colonna, J.P. ; Vidal, V. ; Kies, R. ; Grampeix, H. ; Martin, F. ; Papon, A.M. ; Dansas, H. ; Brianceau, P. ; Licitra, C. ; Barnes, J.P. ; Pananakakis, G. ; Ghibaudo, G. ; De Salvo, B.
Author_Institution :
CEA-LETI MINATEC, Grenoble, France
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
56
Lastpage :
57
Abstract :
In this work we present the integration of Band Engineered TANOS-like memories using HfSiON in the tunnel stack to boost the programming efficiency and improve cycling. An accurate correlation analysis between the gate-stack material physical properties and the memory performances is presented. In particular, the importance of the nitridation step of HfSiON on the memory retention characteristics at high temperature is suggested.
Keywords :
alumina; correlation methods; elemental semiconductors; hafnium compounds; integrated circuit reliability; random-access storage; silicon; silicon compounds; tantalum compounds; HfSiON; TANOS memory reliability; TaN-Al2O3-Si3N4-SiO2-Si; band engineered TANOS-like memory reliability; correlation analysis; gate-stack material physical property; layered HfSiON-based tunnel stacks; memory retention characteristics; voltage reduction; Decision support systems; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-5063-3
Electronic_ISBN :
1524-766X
Type :
conf
DOI :
10.1109/VTSA.2010.5488949
Filename :
5488949
Link To Document :
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