Design of bending test system for silicon micro-beam

Silicon is one of the most commonly used materials for functional structure of microelectromechanical system. Its application is seriously restricted by reliability problems. To study the mechanical properties of silicon microstructures, an off-chip test device is designed, mainly consisting of piezoelectric drive, force sensor and displacement sensor. Secondly, a microstructure for bending test is designed, on which four test beams are integrated. The size of the structure is determined with finite element analysis, the rationality of which is verified through theoretical method. Thirdly, the bending strength of the specimen is tested. Loading curves of experiment and finite element analysis are almost consistent, indicating that the design of the device and structure is rational. This research has laid the foundation for the follow-up reliability tests of the specimen.