DocumentCode
2701409
Title
Reliability allocation for wafer stage system of lithography based on AHP
Author
Li, Mingzhang ; Tang, Yong ; Zeng, Jidong ; Ren, Xianlin ; Li, Haiqing
Author_Institution
Sch. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2012
fDate
15-18 June 2012
Firstpage
1081
Lastpage
1084
Abstract
To ensure the reliability of the wafer stage system of lithography, all factors affecting the wafer stage system reliability were analyzed. A new method based on experts grading method[1] and analytic hierarchy process(AHP)[2] is developed to allocate the reliability indices of wafer stage system. This approach considers not only the experience and knowledge of the expert, but also combines the Comparative Matrix of analytic hierarchy process to reduce the defect that stronger subjective factors of experts grading method. Finally, the wafer stage system of a certain lithography was taken as an example, and the reliability allocation of the system was obtained. The result indicate that the proposed method is feasible and effective.
Keywords
integrated circuit reliability; lithography; matrix algebra; AHP; analytic hierarchy process; comparative matrix; experts grading method; lithography; reliability allocation; reliability indices; wafer stage system reliability; Equations; Lithography; Mathematical model; Reliability engineering; Resource management; Semiconductor device reliability; AHP; experts grading method; reliability allocation; wafer stage system;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2012 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4673-0786-4
Type
conf
DOI
10.1109/ICQR2MSE.2012.6246409
Filename
6246409
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