SPICE temperature modeling for VLSI design using the level-4 model

Author

Wan, Chung-Ping ; Lee, Ji-Chien ; Sheu, Bing J.

Author_Institution

Univ. of Southern California, Los Angeles, CA, USA

fYear

1989

fDate

17-19 May 1989

Firstpage

111

Lastpage

115

Abstract

Complete VLSI (very large scale integration) circuit simulation requires accurate temperature modeling. A modeling methodology using the sensitive parameter subset concept is proposed to provide accurate and efficient prediction of temperature effects for the SPICE level-4 model. A model parameter subset that has large effects on the transistor output characteristics is identified through a sensitivity analysis. Circuit simulation using this approach has shown good agreement with experimental data on device characteristics and the performance of several digital and analog circuits

Keywords

VLSI; circuit CAD; circuit analysis computing; electronic engineering computing; semiconductor device models; sensitivity analysis; CAD; SPICE temperature modeling; VLSI design; circuit simulation; computer aided technique; level-4 model; model parameter subset; sensitive parameter subset concept; sensitivity analysis; transistor output characteristics; very large scale integration; Analog circuits; Circuit optimization; Circuit simulation; MOSFETs; Predictive models; SPICE; Sensitivity analysis; Temperature dependence; Temperature sensors; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on

Conference_Location

Taipei

Type

conf

DOI

10.1109/VTSA.1989.68594

Filename

68594