DocumentCode :
2701446
Title :
Single-crystalline Ge p-channel thin-film transistors with Schottky-barrier source/drain on flexible polyimide substrates
Author :
Hsu, William ; Lin, C.-M. ; Peng, C.-Y. ; Chen, Y.-Y. ; Chen, Y.-T. ; Ho, W.-S. ; Liu, C.W.
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
34
Lastpage :
35
Abstract :
We fabricated the single-crystalline Ge (sc-Ge) p-channel thin-film transistors (TFTs) with Schottky-barrier source/drain (S/D) on flexible polyimide substrates by a simplified low-temperature process (≤ 250°C), which preserves the high mobility Ge channel. Adhesive wafer bonding and Smart-Cut techniques were utilized to transfer the sc-Ge thin film onto polyimide substrates. The device has a linear hole mobility of ~170 cm2V-1s-1, saturation hole mobility of ~120 cm2V-1s-1, and Ion of ~1.6 μA/μm at Vd = -1.5 V for the channel width/length = 280/15μm.
Keywords :
Schottky barriers; adhesive bonding; elemental semiconductors; flexible electronics; germanium; thin film transistors; Ge; Schottky-barrier source/drain; adhesive wafer bonding; flexible polyimide substrates; linear hole mobility; saturation hole mobility; simplified low-temperature process; single-crystalline p-channel thin-film transistors; smart-cut techniques; Capacitance-voltage characteristics; Etching; MOS capacitors; Polyimides; Substrates; Surface treatment; Temperature; Thermal resistance; Thin film transistors; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-5063-3
Electronic_ISBN :
1524-766X
Type :
conf
DOI :
10.1109/VTSA.2010.5488959
Filename :
5488959
Link To Document :
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