DocumentCode
2701594
Title
RF/analog and digital faceoff — friends or enemies in an RF SoC
Author
Hung, Chih-Ming ; Muhammad, Khurram
fYear
2010
fDate
26-28 April 2010
Firstpage
19
Lastpage
20
Abstract
With the ever-increasing functionalities of cellular smart phones and other communication systems, RF circuits at multi-GHz frequencies have recently migrated to the state-of-the-art low-cost digital CMOS processes despite their unfriendly analog design environment. The use of digital techniques to assist RF performance is becoming a common practice. However, there is a general fear that a fully integrated RF SoC containing DSPs could easily fail due to mysterious integration issues such as silicon substrate coupling. In this paper, we will visit some of the practical aspects based on the experiences of integrating the Digital RF Processor (DRP™) in the past ten years. Some conventional wisdom that is actually not wise for RF SoCs will be illustrated. As a result of the successful commercialization of DRPs, CMOS integrated radio SoCs with digitally assisted RF is proven to be one of the clever directions and has opened additional avenues toward software-defined radios.
Keywords
CMOS digital integrated circuits; digital signal processing chips; radiofrequency integrated circuits; software radio; system-on-chip; CMOS integrated radio SoC; DSP; RF SoC; RF analog circuit; RF digital circuit; cellular smart phones; communication systems; digital RF processor; low-cost digital CMOS processes; silicon substrate coupling; software-defined radios; CMOS process; Circuit noise; Clocks; Commercialization; Costs; Coupling circuits; Digital signal processing; Radio frequency; Silicon; Smart phones;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
978-1-4244-5063-3
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2010.5488968
Filename
5488968
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