• DocumentCode
    2701652
  • Title

    Silicon millimeter-wave radios for 60 GHz and beyond

  • Author

    Floyd, Brian ; Valdes Garcia, A. ; Reynolds, S. ; Natarajan, Arutselvan ; Liu, Deming ; Gaucher, B. ; Nakano, Daiju ; Katayama, Yasunao

  • Author_Institution
    T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
  • fYear
    2010
  • fDate
    26-28 April 2010
  • Firstpage
    12
  • Lastpage
    13
  • Abstract
    This paper provides an overview of a 60 GHz transceiver chipset implemented in 0.12 μm SiGe BiCMOS technology, prototype 60 GHz antennas and packages developed for that chipset, and a 60 GHz phased-array receiver front-end. The transceiver chipset achieves 6 dB noise figure in the receiver and 10 dBm output compression point in the transmitter. Folded-dipole and patch antenna arrays developed for the 60 GHz chipset show >90% efficiencies and broad bandwidths. These antennas were attached to the SiGe RF chips, and the packaged chipset has been used to transmit an uncompressed high-definition video stream at 2 Gb/s, with even higher data rates possible. Finally, a 60 GHz RF-combined phased-array receiver front-end is discussed which uses a hybrid parallel/series phase-shifting architecture and which achieves full spatial coverage with reduced phase-shifter requirements.
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; antenna phased arrays; transceivers; BiCMOS technology; folded-dipole antenna arrays; frequency 60 GHz; hybrid parallel/series phase-shifting architecture; patch antenna arrays; phased-array receiver front-end; silicon millimeter-wave radios; size 0.12 mum; transceiver chipset; BiCMOS integrated circuits; Germanium silicon alloys; Millimeter wave technology; Noise figure; Packaging; Prototypes; Radio transmitters; Receiving antennas; Silicon germanium; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-5063-3
  • Type

    conf

  • DOI
    10.1109/VTSA.2010.5488970
  • Filename
    5488970