Title :
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
Abstract :
The following topics were dealt with: adhesives; mechanics of materials; underfill and encapsulants; process control; thermal management; modeling and simulation; integrated passives; high density substrates and packaging; chip scale packages; flip chip bumping
Keywords :
packaging; adhesives; chip scale packages; encapsulants; flip chip bumping; high density substrates; integrated passives; interfaces; mechanics; modeling; packaging materials; process control; simulation; thermal management; underfill;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757276
