DocumentCode
2701681
Title
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
fYear
1999
fDate
14-17 March 1999
Abstract
The following topics were dealt with: adhesives; mechanics of materials; underfill and encapsulants; process control; thermal management; modeling and simulation; integrated passives; high density substrates and packaging; chip scale packages; flip chip bumping
Keywords
packaging; adhesives; chip scale packages; encapsulants; flip chip bumping; high density substrates; integrated passives; interfaces; mechanics; modeling; packaging materials; process control; simulation; thermal management; underfill;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location
Braselton, GA, USA
Print_ISBN
0-930815-56-4
Type
conf
DOI
10.1109/ISAPM.1999.757276
Filename
757276
Link To Document