Title :
Design considerations of 3-D single package communicator (SPC) for quad-band WCDMA/GSM cellular phone
Author :
Kundu, Arun ; Megahed, Mohamed
Author_Institution :
Intel Corp., Chandler, AZ, USA
fDate :
Aug. 28 2010-Sept. 3 2010
Abstract :
A complete single package communicator (SPC) designed and implemented for 3G modem in 400 mm2 size and 1.3 mm height, for the first time is presented. With the help of 3-D technology, development of highly integrated active/passive components and use of latest packaging technology, the design was doable. Optimization of the RF performance of all GSM and WCDAM channels was obtainable despite the small form factor. The design was taped out.
Keywords :
cellular radio; code division multiple access; 3D single package communicator; GSM cellular phone; SPC; active-passive component; quad-band WCDMA; Couplings; Modems; Multiaccess communication; Radio frequency; Spread spectrum communication; Substrates; Transceivers;
Conference_Titel :
Wireless Information Technology and Systems (ICWITS), 2010 IEEE International Conference on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-7091-4
DOI :
10.1109/ICWITS.2010.5611941
