Title :
Development of adhesion promoters to enhance polymer/substrate interface toughness
Author :
Im, J. ; Stokich, T., Jr. ; Hetzner, J. ; Buske, G. ; Curphy, J. ; Shaffer, E.O., II ; Meyers, G.
Author_Institution :
Dow Chem. Co., Midland, MI, USA
Abstract :
The adhesion performance of photo-BCB coatings were investigated using a new adhesion promoter, AP-3000, based on vinyltriacetoxysilane (VTAS) chemistry. A modified edge lift-off test (m-ELT) was employed to evaluate adhesion performance of photo-BCB on various surfaces: Si, SiN, Cu, and Al. Use of AP-3000 resulted in a large improvement of adhesion energies for these interfaces. Atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) of these interfaces showed cohesive interfacial failure into the photo-BCB phase. The interfacial fracture energies approached the fracture toughness of photo-BCB, ca. 45 J/m2
Keywords :
X-ray photoelectron spectra; adhesion; atomic force microscopy; dielectric thin films; failure analysis; fracture toughness; interface structure; optical polymers; packaging; polymer films; AFM; AP-3000 adhesion promoter; Al; Al surface; Cu; Cu surface; Si; Si surface; SiN; SiN surface; VTAS chemistry; X-ray photoelectron spectroscopy; XPS; adhesion energy; adhesion performance; adhesion promoters; atomic force microscopy; cohesive interfacial failure; fracture toughness; interfacial fracture energy; modified edge lift-off test; photo-BCB; photo-BCB coatings; photo-BCB phase; polymer/substrate interface toughness; vinyltriacetoxysilane chemistry; Adhesives; Atomic force microscopy; Chemistry; Coatings; Photoelectron microscopy; Polymers; Silicon compounds; Spectroscopy; Surface cracks; Testing;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757286
