Title :
Underfill adhesion to CycloteneTM (BCB) dielectrics
Author :
Garrou, P. ; Scheck, D. ; Im, J. ; Meyers, G. ; Hawn, D. ; Wu, J. ; Vincent, M. ; Wong, C.P.
Author_Institution :
Dow Chem., Research Triangle Park, NC, USA
Abstract :
The adhesion of several underfills (Dexter Hysol FP4511, FP4527 and CNB775-34) to BCB (CycloteneTM 4022, 4024) has been studied through die shear testing and subsequent failure analysis. Die shear values range between 69 and 90 MPa. Failure analysis indicates that this spread in data probably results from the mixed mode nature of the fracture surfaces. From the die shear data collected before and after 24 hr water boil for Cyclotene 4022 and 4024 (with AP3000 adhesion promoter) and FP 4511 and 4527 underfillers, we find that the die shear strength decreases by an average of 11% for the 4 comparisons
Keywords :
adhesion; boiling; encapsulation; failure analysis; flip-chip devices; fracture; integrated circuit packaging; integrated circuit testing; mechanical testing; polymer films; shear strength; AP3000 adhesion promoter; Cyclotene BCB dielectrics; Dexter Hysol CNB775-34 underfill; Dexter Hysol FP4511 underfill; Dexter Hysol FP4527 underfill; adhesion; die shear; die shear strength; die shear testing; failure analysis; mixed mode fracture surfaces; underfill adhesion; water boil; Adhesives; Cleaning; Dielectric materials; Failure analysis; Glass; Materials testing; Packaging; Silicon; Solvents; Substrates;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757287
