Title :
Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology
Author :
Walker, Anthony ; Baldwin, Daniel
Author_Institution :
Center of Packaging Res., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Advances in electronics packaging and assembly technology are driving increased demand for ultra-fine pitch solder deposition. In this work, innovative solder deposition techniques based on laser printing are being investigated for low-cost ultra-fine pitch printing applications. This paper investigates the feasibility of using solder particles in off-the-shelf xerographic technology. The physics of the two development systems (dual component and monocomponent) are discussed. This inquisition leads to a discussion of triboelectric charging of the solder toners, coating the solder with thin dielectrics, and charge induction by an applied electric field. The results from these investigations are used to assess feasibility and define future work
Keywords :
assembling; coating techniques; fine-pitch technology; laser materials processing; packaging; soldering; surface charging; applied electric field; assembly technology; charge induction; dual component system; electronics packaging; feasibility; laser printing; laser printing technology; monocomponent system; solder deposition techniques; solder particles; solder thin dielectric coating; solder toners; triboelectric charging; ultra-fine pitch printing applications; ultra-fine pitch solder deposition; ultra-fine pitch solder printing process; xerographic technology; Application software; Assembly; Costs; Dielectrics; Electronics packaging; Electrophotography; Flip chip; Mechanical engineering; Optical devices; Printing;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757295
