DocumentCode
2702120
Title
Research on conductive performance of inkjet printing samples by conductive inkjet ink
Author
Fang Yi ; Li Luhai ; Xin Zhiqing ; Zhao Wen
Author_Institution
Lab. of Printing & Packaging Mater. & Technol., Beijing Inst. of Graphic Commun., Beijing, China
fYear
2009
fDate
27-29 Oct. 2009
Firstpage
63
Lastpage
66
Abstract
By using the liquid-phase chemical reduction method, under the protection of PVP at the use of hydrazine hydrate reduction of silver nitrate, obtain a nano-silver suspension of high concentration. After adjusting parameters such as surface tension, conductive ink-jet ink was prepared for printing on. With digital microscopes, scanning electron microscopy (SEM) and four-probe tester, different samples of printing times were characterized. Results show that samples which printed for more than two times have conductive capability. Printing samples will be treated by washing treatment, low temperature heating treatment and laser sintering treatment. It was found that its conductive performance can be improved. One of the post-treatments by the laser sintering could obtain a best proof which´s surface resistance reduced to 4 ¿/¿ after sintering which was 270 ¿/¿ previously.
Keywords
colloids; electrical conductivity; ink jet printing; laser materials processing; microstrip antennas; nanostructured materials; printed circuit manufacture; radiofrequency identification; reduction (chemical); scanning electron microscopy; silver compounds; sintering; suspensions; AgNO3; PVP; SEM; conductive inkjet ink; digital microscope; four probe tester; hydrazine hydrate reduction; inkjet printing; laser sintering; liquid phase chemical reduction method; nanosilver suspension; scanning electron microscopy; Chemicals; Ink; Laser sintering; Printing; Propellants; Protection; Scanning electron microscopy; Silver; Surface resistance; Surface tension; conductive inkjet ink; conductive performance; nano-silver particles;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4076-4
Type
conf
DOI
10.1109/MAPE.2009.5355553
Filename
5355553
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