Electrically anisotropic conductive adhesives: a new model for conduction mechanism

Author

Shi, Frank G. ; Abdullah, Mikrajuddin ; Chungpaiboonpatana, S. ; Okuyama, Kikuo ; Davidson, Craig ; Adams, Joseph M.

Author_Institution

Sch. of Eng., California Univ., Irvine, CA, USA

fYear

1999

fDate

14-17 Mar 1999

Firstpage

163

Lastpage

168

Abstract

A new model for the force-resistance relationship for anisotropic conductive adhesives is introduced by considering for the first time the effect of metal particle size distribution. It is shown that there is a universal power-law relationship between the applied force and the resistance of anisotropic ECAs. The theoretical predictions are found to be fully supported by experimental observations

Keywords

adhesives; conducting polymers; electric resistance; electrical conductivity; filled polymers; packaging; particle size; anisotropic ECAs; anisotropic conductive adhesives; applied force; conduction mechanism model; electrically anisotropic conductive adhesives; force-resistance relationship; metal particle size distribution effect; resistance; universal power-law relationship; Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Contact resistance; Electronics industry; Packaging; Power engineering and energy; Power system modeling; Shape; Tunneling;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757305

Filename

757305