Title :
Modeling ceramic filled polymer integrated capacitor formation using neural networks
Author :
Thongvigitmanee, Thongchai ; May, Gary S.
Author_Institution :
Center of Packaging Res., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Integrated decoupling capacitors for MCM-L/D technology are an important component for next-generation electronic packaging applications. This paper presents a statistically designed experiment for systematic characterization of the dielectric constant and loss tangent of integrated capacitors formed by mixing lead magnesium niobate (PMN) particles into polyimide and benzocyclobutene (BCB) polymer dielectric layers. We determine these quantities as a function of the type of polymer material, the volume fraction of ceramic in the polymer matrix, and the polymer cure time and temperature. These factors have been examined by means of a D-optimal experiment. Results indicate manipulation of each of the four factors over the ranges examined proved statistically significant and led to considerable variations in dielectric constant and loss tangent. Based on data from these experiments, we train neural networks to model the process variation as a function of above variables. Using this methodology, we determine proper combinations of polymer/ceramic materials and processing conditions to achieve desirable electrical properties
Keywords :
capacitors; design of experiments; dielectric losses; filled polymers; integrated circuit packaging; lead compounds; learning (artificial intelligence); magnesium compounds; multichip modules; neural nets; permittivity; polymer films; D-optimal experiment; MCM-L/D technology; PMN particles; PbMgNbO3; ceramic filled polymer integrated capacitor formation; ceramic volume fraction; dielectric constant; dielectric loss tangent; electrical properties; electronic packaging applications; integrated capacitors; integrated decoupling capacitors; lead magnesium niobate particles; modeling; neural network process variation model; neural network training; neural networks; polyimide/benzocyclobutene polymer dielectric layers; polymer cure temperature; polymer cure time; polymer material; polymer matrix; polymer/ceramic materials; processing conditions; statistically designed experiment; systematic characterization; Capacitors; Ceramics; Dielectric constant; Dielectric losses; Dielectric materials; Electronics packaging; Magnesium; Niobium compounds; Polyimides; Polymers;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757307