Title :
Study on thermal behaviour of LED package at various ambient temperatures
Author :
Lee, Zhi-Yin ; Devarajan, Mutharasu
Author_Institution :
Sch. of Phys., Univ. Sains Malaysia, Minden, Malaysia
Abstract :
Study on thermal behaviour for a Light-Emitting Diode (LED) package under different ambient temperatures was presented in this paper. Thermal transient measurements were carried out by using the Thermal Transient Tester (T3Ster) at each ambient temperature of 30°C, 50°C, 70°C, and 90°C T3Ster-Master evaluation software was adopted to analyze the recorded thermal transient structure function. Experimental results show that as the ambient temperature increases, the junction-to-ambient thermal resistance, RthJA an LED package will increase.
Keywords :
light emitting diodes; packaging; LED package; T3Ster-Master evaluation software; junction-to-ambient thermal resistance; light emitting diode; temperature 30 C; temperature 50 C; temperature 70 C; temperature 90 C; thermal behaviour; thermal transient measurements; thermal transient tester; Current measurement; Equations; Junctions; Light emitting diodes; Manufacturing; Reliability; Temperature measurement;
Conference_Titel :
Photonics (ICP), 2011 IEEE 2nd International Conference on
Conference_Location :
Kata Kinabalu
Print_ISBN :
978-1-61284-265-3
Electronic_ISBN :
978-1-61284-263-9
DOI :
10.1109/ICP.2011.6106840