• DocumentCode
    2702285
  • Title

    Study on thermal behaviour of LED package at various ambient temperatures

  • Author

    Lee, Zhi-Yin ; Devarajan, Mutharasu

  • Author_Institution
    Sch. of Phys., Univ. Sains Malaysia, Minden, Malaysia
  • fYear
    2011
  • fDate
    17-19 Oct. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Study on thermal behaviour for a Light-Emitting Diode (LED) package under different ambient temperatures was presented in this paper. Thermal transient measurements were carried out by using the Thermal Transient Tester (T3Ster) at each ambient temperature of 30°C, 50°C, 70°C, and 90°C T3Ster-Master evaluation software was adopted to analyze the recorded thermal transient structure function. Experimental results show that as the ambient temperature increases, the junction-to-ambient thermal resistance, RthJA an LED package will increase.
  • Keywords
    light emitting diodes; packaging; LED package; T3Ster-Master evaluation software; junction-to-ambient thermal resistance; light emitting diode; temperature 30 C; temperature 50 C; temperature 70 C; temperature 90 C; thermal behaviour; thermal transient measurements; thermal transient tester; Current measurement; Equations; Junctions; Light emitting diodes; Manufacturing; Reliability; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics (ICP), 2011 IEEE 2nd International Conference on
  • Conference_Location
    Kata Kinabalu
  • Print_ISBN
    978-1-61284-265-3
  • Electronic_ISBN
    978-1-61284-263-9
  • Type

    conf

  • DOI
    10.1109/ICP.2011.6106840
  • Filename
    6106840
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2702285