DocumentCode
2702300
Title
An overview of the NCMS/StorageTek embedded decoupling capacitance project
Author
Bowles, Philip H. ; Charbonneau, Richard
fYear
1999
fDate
14-17 Mar 1999
Firstpage
191
Lastpage
196
Abstract
The need for power-ground decoupling capacitance is nearly universal in electronic circuits. NCMS, NEMI and StorageTek have organized a project aimed at advancing the use of embedded capacitance technology for power supply decoupling. Embedding the capacitance in the PWB frees up space that can be used for other functions. The technology may also improve performance and reliability by reducing the number of solder joints and discrete capacitors, and the associated failure modes. Total system cost may also be lowered as a result of parts reduction and circuit integration. This presentation reviews the details of the project including project members, goals and objectives, test vehicle design, material considerations, electrical and qualification testing, modeling, deliverables, and timeline. This is a short-term project, intended to evaluate available materials, and to result in usable (designable, manufacturable, and cost-effective) embedded capacitance. The ultimate aim is to make this new technology a practical alternative in the very near future
Keywords
capacitance; capacitors; circuit reliability; printed circuit design; printed circuit manufacture; printed circuit testing; NCMS/StorageTek embedded decoupling capacitance project; PWB embedded capacitance; circuit integration; cost-effectiveness; discrete capacitors; electrical testing; electronic circuits; embedded capacitance; embedded capacitance technology; embedded decoupling capacitance; failure modes; material considerations; modeling; parts reduction; power supply decoupling; power-ground decoupling capacitance; project deliverables; project timeline; qualification testing; reliability; solder joints; system cost; test vehicle design; Capacitance; Capacitors; Circuit testing; Electronic circuits; Integrated circuit reliability; Materials testing; Power supplies; Power system reliability; Soldering; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-56-4
Type
conf
DOI
10.1109/ISAPM.1999.757310
Filename
757310
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