• DocumentCode
    2702300
  • Title

    An overview of the NCMS/StorageTek embedded decoupling capacitance project

  • Author

    Bowles, Philip H. ; Charbonneau, Richard

  • fYear
    1999
  • fDate
    14-17 Mar 1999
  • Firstpage
    191
  • Lastpage
    196
  • Abstract
    The need for power-ground decoupling capacitance is nearly universal in electronic circuits. NCMS, NEMI and StorageTek have organized a project aimed at advancing the use of embedded capacitance technology for power supply decoupling. Embedding the capacitance in the PWB frees up space that can be used for other functions. The technology may also improve performance and reliability by reducing the number of solder joints and discrete capacitors, and the associated failure modes. Total system cost may also be lowered as a result of parts reduction and circuit integration. This presentation reviews the details of the project including project members, goals and objectives, test vehicle design, material considerations, electrical and qualification testing, modeling, deliverables, and timeline. This is a short-term project, intended to evaluate available materials, and to result in usable (designable, manufacturable, and cost-effective) embedded capacitance. The ultimate aim is to make this new technology a practical alternative in the very near future
  • Keywords
    capacitance; capacitors; circuit reliability; printed circuit design; printed circuit manufacture; printed circuit testing; NCMS/StorageTek embedded decoupling capacitance project; PWB embedded capacitance; circuit integration; cost-effectiveness; discrete capacitors; electrical testing; electronic circuits; embedded capacitance; embedded capacitance technology; embedded decoupling capacitance; failure modes; material considerations; modeling; parts reduction; power supply decoupling; power-ground decoupling capacitance; project deliverables; project timeline; qualification testing; reliability; solder joints; system cost; test vehicle design; Capacitance; Capacitors; Circuit testing; Electronic circuits; Integrated circuit reliability; Materials testing; Power supplies; Power system reliability; Soldering; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-56-4
  • Type

    conf

  • DOI
    10.1109/ISAPM.1999.757310
  • Filename
    757310