Title :
MCM-D/C packaging solution for IBM latest S/390 servers
Author :
Perfecto, Eric D. ; Shields, Ronald R. ; Jeanneret, Mathias P. ; Malhotra, Ashwani K. ; McHerron, Dale C.
Author_Institution :
IBM Microelectron., Hopewell Junction, NY, USA
Abstract :
The G5, fastest member of the S390 server family, was announced in May of 1998. The multichip module (MCM) used consists of 29 CMOS chips on a 127.5 mm glass ceramic substrate with 6 levels of thin films (TF) including 1 signal plane pair. The G5 system performance exceeded 1,000 MIPS. This breakthrough performance resulted from the synergy created by combining IBM´s leadership technologies in CMOS high frequency microprocessor design with advanced packaging and flip chip interconnections. From a substrate perspective, IBM moved from alumina ceramic and Mo conductors to glass ceramic and Cu, and from TF redistribution (4 levels) to TF wiring (6 levels). This paper discusses the TF implications from a change of substrate material and increased wiring density, as well as the need to implement a polyimide cushion layer as part of the pin grid array (PGA) fabrication process to support 4224 I/Os
Keywords :
CMOS digital integrated circuits; ceramic packaging; flip-chip devices; glass ceramics; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; multichip modules; network servers; polymer films; 127.5 mm; CMOS chips; CMOS high frequency microprocessor design; Cu; Cu conductors; G5 system performance; IBM S/390 G5 servers; MCM-C packaging; MCM-D packaging; Mo conductors; S390 server family; alumina ceramic; flip chip interconnections; glass ceramic; glass ceramic substrate; multichip module; package substrate; packaging; pin grid array fabrication process; polyimide cushion layer; signal plane pair; substrate material; thin film levels; thin film redistribution; thin film wiring; wiring density; CMOS technology; Ceramics; Conducting materials; Electronics packaging; Frequency; Glass; Multichip modules; System performance; Transistors; Wiring;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757313
