MCM-D/C packaging solution for IBM latest S/390 servers

Author

Perfecto, Eric D. ; Shields, Ronald R. ; Jeanneret, Mathias P. ; Malhotra, Ashwani K. ; McHerron, Dale C.

Author_Institution

IBM Microelectron., Hopewell Junction, NY, USA

fYear

1999

fDate

14-17 Mar 1999

Firstpage

209

Lastpage

213

Abstract

The G5, fastest member of the S390 server family, was announced in May of 1998. The multichip module (MCM) used consists of 29 CMOS chips on a 127.5 mm glass ceramic substrate with 6 levels of thin films (TF) including 1 signal plane pair. The G5 system performance exceeded 1,000 MIPS. This breakthrough performance resulted from the synergy created by combining IBM´s leadership technologies in CMOS high frequency microprocessor design with advanced packaging and flip chip interconnections. From a substrate perspective, IBM moved from alumina ceramic and Mo conductors to glass ceramic and Cu, and from TF redistribution (4 levels) to TF wiring (6 levels). This paper discusses the TF implications from a change of substrate material and increased wiring density, as well as the need to implement a polyimide cushion layer as part of the pin grid array (PGA) fabrication process to support 4224 I/Os

Keywords

CMOS digital integrated circuits; ceramic packaging; flip-chip devices; glass ceramics; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; multichip modules; network servers; polymer films; 127.5 mm; CMOS chips; CMOS high frequency microprocessor design; Cu; Cu conductors; G5 system performance; IBM S/390 G5 servers; MCM-C packaging; MCM-D packaging; Mo conductors; S390 server family; alumina ceramic; flip chip interconnections; glass ceramic; glass ceramic substrate; multichip module; package substrate; packaging; pin grid array fabrication process; polyimide cushion layer; signal plane pair; substrate material; thin film levels; thin film redistribution; thin film wiring; wiring density; CMOS technology; Ceramics; Conducting materials; Electronics packaging; Frequency; Glass; Multichip modules; System performance; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757313

Filename

757313