• DocumentCode
    2702446
  • Title

    Low-loss millimeter-wave passives on Si

  • Author

    Uemichi, Yusuke ; Hatakeyama, Hideki ; Aizawa, Takuya ; Amakawa, Shuhei ; Okada, Kenichi ; Ishihara, Noboru ; Masu, Kazuya

  • Author_Institution
    Electron Device Lab., Fujikura.Ltd., Japan
  • fYear
    2010
  • fDate
    Aug. 28 2010-Sept. 3 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We propose a glass platform integrating passives for the millimeter-wave module, which is fabricated by the same technology applied to Wafer-Level Packaging(WLP). The WLP is one of the confirmed IC packaging processes having merits of low cost and small package size.
  • Keywords
    wafer level packaging; IC packaging; glass platform; low-loss millimeter-wave passives; millimeter-wave module; wafer-level packaging; Band pass filters; CMOS integrated circuits; Impedance matching; Loss measurement; Microstrip; Millimeter wave technology; Resins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Information Technology and Systems (ICWITS), 2010 IEEE International Conference on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-7091-4
  • Type

    conf

  • DOI
    10.1109/ICWITS.2010.5611977
  • Filename
    5611977
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2702446