Title :
Low-loss millimeter-wave passives on Si
Author :
Uemichi, Yusuke ; Hatakeyama, Hideki ; Aizawa, Takuya ; Amakawa, Shuhei ; Okada, Kenichi ; Ishihara, Noboru ; Masu, Kazuya
Author_Institution :
Electron Device Lab., Fujikura.Ltd., Japan
fDate :
Aug. 28 2010-Sept. 3 2010
Abstract :
We propose a glass platform integrating passives for the millimeter-wave module, which is fabricated by the same technology applied to Wafer-Level Packaging(WLP). The WLP is one of the confirmed IC packaging processes having merits of low cost and small package size.
Keywords :
wafer level packaging; IC packaging; glass platform; low-loss millimeter-wave passives; millimeter-wave module; wafer-level packaging; Band pass filters; CMOS integrated circuits; Impedance matching; Loss measurement; Microstrip; Millimeter wave technology; Resins;
Conference_Titel :
Wireless Information Technology and Systems (ICWITS), 2010 IEEE International Conference on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-7091-4
DOI :
10.1109/ICWITS.2010.5611977
