DocumentCode :
2702534
Title :
Characterization of oscillating nano knife for single cell cutting by nanorobotic manipulation system inside ESEM
Author :
Shen, Yajing ; Nakajima, Masahiro ; Kojima, Seiji ; Homma, Michio ; Ode, Yasuhito ; Fukuda, Toshio
Author_Institution :
Dept. of Micro-Nano Syst. Eng., Nagoya Univ., Nagoya, Japan
fYear :
2011
fDate :
9-13 May 2011
Firstpage :
4133
Lastpage :
4138
Abstract :
In this paper, a novel oscillating nano knife for single cell cutting at its native state was proposed. The nano knife with a small edge angle 5° was fabricated from a commercial AFM cantilever by focused ion beam (FIB) etching. The spring constant of the nano knife was calibrated by nanorobotic manipulation method. A piezo actuator was employed to generate the vibration of the nano knife. The oscillating amplitude response to the applied voltage was calculated based on the realtime image observation. Single yeast cell (W303) cutting using oscillating nano knife was performed based on the nanorobotic manipulation system inside an environment-SEM. The maximum cutting forces and the slices angle were measured from the deformation of the nano knife beam and the single cell. The result showed the oscillating nano knife was capable and effective for single cell cutting task.
Keywords :
atomic force microscopy; beams (structures); cantilevers; cellular biophysics; cutting; focused ion beam technology; manipulators; microorganisms; nanobiotechnology; nanofabrication; piezoelectric actuators; scanning electron microscopy; springs (mechanical); sputter etching; vibrations; ESEM; commercial AFM cantilever; environmental SEM; focused ion beam etching; nanoknife beam deformation; nanorobotic manipulation method; oscillating amplitude; oscillating nanoknife; piezo actuator; realtime image observation; single yeast cell cutting; spring constant; vibration generation; Actuators; Etching; Force; Manipulators; Materials; Nanobioscience; Springs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Automation (ICRA), 2011 IEEE International Conference on
Conference_Location :
Shanghai
ISSN :
1050-4729
Print_ISBN :
978-1-61284-386-5
Type :
conf
DOI :
10.1109/ICRA.2011.5980466
Filename :
5980466
Link To Document :
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