An oxidation study of Cu leadframes

Author

Berriche, R. ; Lowry, R. ; Rosenfield, M.I.

Author_Institution

Harris Semicond., Melbourne, FL, USA

fYear

1999

fDate

14-17 Mar 1999

Firstpage

275

Lastpage

281

Abstract

The oxidation of Cu leadframes was studied at 175 and 200°C, for bake times of 2, 5, 10, 20, 30, 50, 100 and 200 minutes, and 15 and 99 hours. Depending on the temperature and the bake time, the leadframe displayed the following range of colors: reddish, purplish, silvery, golden, greenish, brown, black or a blend of these colors. Associated changes in the thickness of the copper oxide was measured by sequential electrochemical reduction analysis (SERA) and secondary ion mass spectroscopy (SIMS), the composition of the oxide layer was evaluated by X-ray photoelectron spectroscopy (XPS) analysis, and the surface roughness was measured by scanning probe microscopy (SPM). The mechanical properties of the oxide layer were evaluated by the stud pull test and Vickers micro-indentation

Keywords

Vickers hardness; X-ray photoelectron spectra; adhesion; copper; electrochemical analysis; heat treatment; integrated circuit packaging; integrated circuit testing; mass spectroscopic chemical analysis; mechanical testing; oxidation; secondary ion mass spectra; surface composition; surface topography; 10 min; 100 min; 15 hr; 175 C; 2 min; 20 min; 200 C; 200 min; 30 min; 5 min; 50 min; 99 hr; Cu; Cu leadframe oxidation; Cu leadframes; CuO-Cu; SERA; SIMS; SPM; Vickers micro-indentation; X-ray photoelectron spectroscopy; XPS; bake temperature; bake time; copper oxide thickness; leadframe colour; oxidation; oxide layer composition; oxide layer mechanical properties; scanning probe microscopy; secondary ion mass spectroscopy; sequential electrochemical reduction analysis; stud pull test; surface roughness; Copper; Mass spectroscopy; Mechanical factors; Oxidation; Rough surfaces; Scanning probe microscopy; Surface roughness; Temperature dependence; Temperature distribution; Thickness measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757326

Filename

757326