DocumentCode :
2702626
Title :
Electrically isotropic conductive adhesives: an effective contact resistance model for conductivity development
Author :
Abdullah, Mikrajuddin ; Shi, Frank G. ; Chungpaiboonpatana, Surasit ; Okuyama, Kikuo ; Davidson, Craig ; Adams, Joseph M.
Author_Institution :
Fac. of Eng., Hiroshima Univ., Japan
fYear :
1999
fDate :
14-17 Mar 1999
Firstpage :
282
Lastpage :
287
Abstract :
A model for determination of the electrical resistivity of isotropic conductive adhesives and insulator/conductor composites in general is introduced by considering the role of contact resistance between conductive adhesive constituents. Conductive behaviour is considered to depend on the creation of conducting contacts between metallic filler particles instead of increasing in the concentration of metal particles. This paper resolves several previously unsolved issues, including the effect of the volume fraction of filler particles and particle size on the development of conductivity; the observed variation in percolation threshold; and the possibility of occurence of two percolation thresholds. In addition, the predicted pressure dependence of conductive behaviour is fully supported by the experimental observations. The model also predicts that the percolation threshold can be reduced by pressure
Keywords :
adhesives; conducting polymers; contact resistance; electrical conductivity; electrical resistivity; filled polymers; particle size; percolation; conducting contacts; conductive adhesive constituents; conductive behaviour; conductivity; conductivity development; contact resistance; effective contact resistance model; electrical resistivity; electrically isotropic conductive adhesives; filler particle size; filler particle volume fraction; insulator/conductor composites; isotropic conductive adhesives; metal particle concentration; metallic filler particles; model; percolation threshold; pressure dependence; Conducting materials; Conductive adhesives; Conductivity; Conductors; Contact resistance; Dielectrics and electrical insulation; Electric resistance; Microelectronics; Predictive models; Resistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
Type :
conf
DOI :
10.1109/ISAPM.1999.757327
Filename :
757327
Link To Document :
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