Title :
An Energy-Efficient Implantable Transponder for Biomedical Piezo-Resistance Pressure Sensors
Author :
Trung Thanh Nguyen ; Fernandes, Luis Ande L. ; Häfliger, Philipp
Author_Institution :
Dept. of Inf., Oslo Univ., Oslo, Norway
Abstract :
An implantable transponder with wireless link for biomedical applications is presented. The application specific integrated circuit (ASIC) is energy optimized for a Wheatstone configured piezoresistive pressure sensor. The system takes advantage of an extremely low duty cycle reducing significantly the energy consumption. A net differential input swing voltage is obtained from only a single resistive sensor branch by interchanging the sensor supply polarity alternately. The ASIC was fabricated in TSMC 90 nm CMOS process with an area of 0.37 mm2. The transponder is powered by a 13.56 MHz radio frequency signal and performs sensor signal amplification, analog to digital conversion and uplink data transmission through load shift keying within 96 μs every 5 min. This results in a total energy consumption for the complete system on the implant side of 12.5 nJ per sample for a resolution of 7.03 effective bits.
Keywords :
CMOS digital integrated circuits; analogue-digital conversion; application specific integrated circuits; biomedical equipment; data communication; energy consumption; piezoresistive devices; pressure sensors; prosthetics; radio links; transponders; ASIC; CMOS; TSMC; analog-digital conversion; application specific integrated circuit; biomedical applications; biomedical piezo-resistance pressure sensors; differential input swing voltage; energy consumption; energy-efficient implantable transponder; sensor supply polarity; single resistive sensor branch; uplink data transmission; wheat-stone configured piezoresistive pressure sensor; wireless link; Biosensors; Clocks; Coils; Sensor systems; Transponders; Voltage control; Glucose sensor; LSK; piezoresistive pressure sensor; readout circuit; telemetry; transponder chip; wireless;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2014.2304566