Adhesion studies of model epoxy systems and commercial underfill resins

Author

Pearson, R.A. ; Komnopad, P.

Author_Institution

Lab. of Microelectron. Packaging Mater., Lehigh Univ., Bethlehem, PA, USA

fYear

1999

fDate

14-17 Mar 1999

Firstpage

344

Lastpage

350

Abstract

The fracture behavior of model epoxy systems and commercial underfill resins for flip chip assembly solder joint encapsulation has been studied. In some cases, the energy dissipation mechanisms are similar. The high filler loading makes detection of the subsurface damage difficult and more can be learned from the model systems. Thus far, we have determined that the same mechanisms that occur in the bulk also occur in adhesive joints. However, the extent of these mechanisms can vary. Currently, we are studying methods to increase the surface energy of polyimide and to improve adhesion

Keywords

adhesion; encapsulation; filled polymers; flip-chip devices; fracture; integrated circuit packaging; integrated circuit testing; mechanical testing; surface energy; adhesion; adhesive joints; energy dissipation mechanisms; filler loading; flip chip assembly solder joint encapsulation; fracture behavior; model epoxy systems; polyimide surface energy; subsurface damage detection; underfill resins; Adhesives; Chemicals; Epoxy resins; Flip chip; Laboratories; Microelectronics; Packaging; Polymers; Surface cracks; Thermodynamics;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757336

Filename

757336