Thermal analysis of multi-chip LED package with different position and ambient temperatures

Junction temperature and thermal resistance are important factors in determining the overall performance of LED packages. Thermal transient measurements of multi-chip high brightness LED package with two specified positions under various ambient temperatures are discussed in this paper. Case 1 and case 2 are introduced as the inclined angle of the package at 0° and 90°. The main goal is to study the thermal characteristics of the LED package at different degree of inclinations using thermal transient tester (T3ster). Experimental results on junction temperature and thermal resistance for both cases at different ambient temperature are presented. From the obtained structure functions, results shows that the position of an LED package would influence the heat transfer of the whole LED package.