ASIC/MCM and microcircuit testing using commercial practices

Author

Miller, Micheal ; Myers, Mark

Author_Institution

Wright Lab. Manuf. Technol. Directorate, USA

Volume

2

fYear

1996

fDate

20-23 May 1996

Firstpage

874

Abstract

Plastic Encapsulated Microelectronics (PEMs) components are used increasing numbers in military applications. Influencing factors are improving reliability, greater availability and Federal initiatives for use. This discussion focuses on efforts to introduce plastic encapsulated microcircuits to a highly complex, highly integrated military product. The emphasis is on reliability testing of these components. Reliability testing of PEM\´s for military applications has been somewhat limited in “high-end” devices and packages. This discussion focuses on testing of a wide range of die sizes including large die (⩾0.5" per side), and a wide range of packages, including large packages (up to 2"×2" per side) for both custom and off-the-shelf commercial packages

Keywords

application specific integrated circuits; electronic equipment testing; encapsulation; integrated circuit packaging; integrated circuit testing; military equipment; multichip modules; plastic packaging; reliability; 0.5 in; 2 in; ASIC; MCM testing; Plastic Encapsulated Microelectronics; availability; custom packages; design verification; die sizes; integrated military product; microcircuit testing; military applications; moisture; off-the-shelf commercial packages; plastic encapsulated microcircuits; reliability; reliability testing; Aerospace electronics; Application specific integrated circuits; Availability; Costs; Electronics packaging; Manufacturing; Military aircraft; Plastic packaging; Process design; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1996. NAECON 1996., Proceedings of the IEEE 1996 National

Conference_Location

Dayton, OH

ISSN

0547-3578

Print_ISBN

0-7803-3306-3

Type

conf

DOI

10.1109/NAECON.1996.517755

Filename

517755