A simple and compact tri-band planar inverted-F antenna for personal communication handset applications

Author

Zhu, FuGuo ; Zhang, Chong ; Xu, Jiadong

Author_Institution

Sch. of Electron. & Inf., Northwestern Polytech. Univ., Xi´´an, China

fYear

2009

fDate

27-29 Oct. 2009

Firstpage

573

Lastpage

575

Abstract

A simple and compact planar inverted-F antenna (PIFA) with size of 35 mm Ã— 25 mm Ã— 6 mm for personal communication handset applications is proposed in this paper. The radiating patch is folded at end and etched with two slits to create multiple resonant frequency bands. The antenna covers following frequency bands: Global System for Mobile communication (GSM900, 880-960 MHz)/Digital Communication System (DCS1800 MHz, 1710-1880 MHz)/Bluetooth (2450 MHz, 2400-2480 MHz). The proposed antenna has been designed and analyzed by using commercially available software, High Frequency Structure Simulator (HFSS) based on the finite element method algorithm. We also fabricate the proposed antenna and the measurement is carried out by using E8363B Vector Network Analyzer of Agilent. The simulated results agree quite well with the experimental results.

Keywords

Bluetooth; UHF antennas; cellular radio; mobile handsets; multifrequency antennas; planar inverted-F antennas; Bluetooth; DCS1800 MHz; Digital Communication System; GSM900; Global System for Mobile communication; finite element method; frequency 1710 MHz to 1880 MHz; frequency 2400 MHz to 2480 MHz; frequency 880 MHz to 960 MHz; high frequency structure simulator; multiple resonant frequency bands; personal communication handset application; radiating patch; triband planar inverted-F antenna; Algorithm design and analysis; Analytical models; Bluetooth; Digital communication; Etching; Finite element methods; GSM; Mobile antennas; Resonant frequency; Telephone sets; PIFA; multiple resonant frequency bands;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4076-4

Type

conf

DOI

10.1109/MAPE.2009.5355604

Filename

5355604