Title :
Cooling performance of impinging jet from piezoelectric micro blower mounted in narrow flow passage
Author :
Fukue, Takashi ; Hirose, Koichi ; Terao, Hirotoshi
Author_Institution :
Dept. of Mech. Eng., Iwate Univ., Morioka, Japan
Abstract :
This study investigates a cooling performance of a miniature piezoelectric micro blower. The piezoelectric micro blower is a novel airflow generator which combines a compact size which can be usable in a narrow clearance between the components with the high performance which can generate high speed airflow (about 20 m/s) regardless of a high pressure drop in the narrow clearance. We are investigating whether the piezoelectric micro blower is available for a novel cooling method of high-density packaging electronic equipment or not. Because of the miniature structure of the piezoelectric micro blower, a supply flow rate of the blower becomes relatively small. However, because the piezoelectric micro blower can generate the high speed airflow, the higher cooling performance than other micro fans may be obtained. Therefore, an investigation of a net cooling performance of the jet from the piezoelectric micro blower should be clarified. In this report, we tried to evaluate the cooling performance of an impinging jet from the piezoelectric micro blower by using 3DCFD (Computational Fluid Dynamics) analysis. The piezoelectric micro blower was mounted in front of test heat sinks and generated the impinging jet. The cooling performance of the heat sink with the impinging jet from the piezoelectric micro blower was evaluated while changing dimensions of the heat sink. Through the investigation, information about the optimum dimensions and types of the heat sink for improving cooling performance of the piezoelectric micro blower was obtained.
Keywords :
computational fluid dynamics; cooling; electronics packaging; fans; heat sinks; jets; micromechanical devices; piezoelectric devices; 3DCFD analysis; airflow generator; compact size; computational fluid dynamics; cooling performance; high-density packaging electronic equipment; high-speed airflow; impinging jet; microfans; narrow-flow passage; piezoelectric micro blower; supply flow rate; test heat sinks; Computational fluid dynamics; Geometry; Heat sinks; Heat transfer; Performance evaluation; Resistance heating; Forced Convection Cooling; High-Density Packaging; Micro Impinging Jet; Piezoelectric Micro Blower; Pin Fin Heat Sink; Thermal Design;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111086