Laser diode array packaging for coupling to optical polyimide waveguides in optoelectronic multichip modules

Opto-electronic multichip modules (OE-MCMs) using organic optical waveguides formed on copper-polyimide multilayer substrates are a promising packaging technology for future photonic switching systems. A laser diode (LD) array packaging technique for coupling to polyimide waveguides on the OE-substrate was developed, in which junction-up, 5-channel InGaAsP edge-emitting LD array (λ=1.3 μm) was positioned on the terrace with passive alignment in the vertical direction, then butt-coupled to the waveguides on the OE-substrate. Optical interconnections between the 5-ch LD array and the waveguides were achieved with the coupling loss of 6.5 dB and deviation between channels of ±0.5 dB