DocumentCode
2703607
Title
A LTCC band pass filter for wireless applications
Author
Yuan, Bo ; Yu, Weihua ; Sun, Houjun ; Lv, Xin
Author_Institution
Dept. of Electron. Eng., Beijing Inst. of Technol., Beijing, China
fYear
2009
fDate
27-29 Oct. 2009
Firstpage
470
Lastpage
472
Abstract
MCM (Multi-chip Module) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Filter is one of the most important components in the MCM. In this paper, a novel quasi-lumped band pass filter for wireless front-end was designed and fabricated, adopting low-temperature cofired ceramics (LTCC). The BPF circuit is based on the quasi-lumped filter topology and a wideband circuit design method was adopted. The BPF has been simulated and optimized by Ansoft HFSS. The measured results which were tested not only in the normal atmospheric temperature but also in the high and low temperature agree very well with the full-wave electromagnetic designed responses The proposed filter has been realized in a ten layers ceramic substrate, showing promising application potentials in miniaturized wireless front-end.
Keywords
band-pass filters; ceramic packaging; radio equipment; BPF circuit; LTCC band pass filter; low-temperature cofired ceramics; multichip module; quasilumped band pass filter; quasilumped filter topology; wideband circuit design; wireless application; wireless front-end application; Atmospheric measurements; Atmospheric modeling; Band pass filters; Ceramics; Circuit simulation; Circuit synthesis; Circuit topology; Electromagnetic measurements; Temperature; Wideband; band pass filter (BPF); low-temperature co-fired ceramics ( LTTC); miniaturization; wireless front-end;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4076-4
Type
conf
DOI
10.1109/MAPE.2009.5355635
Filename
5355635
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