Title :
High temperature applications for IC plastic encapsulated packages
Author :
Chen, Andrea S. ; Lo, Randy H Y
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
In this study, comparisons were made between different compound chemistries-cresol novolac, biphenyl, and multifunctional-using the High Temperature Storage Life Test, at 175°C and at 200°C. Static Operating Life Testing at 175°C was also performed on the multi-functional compound. Failure analysis was performed on a sample of the tested units. However, with the testing temperatures above the glass transition temperatures, over-testing may be an issue and must be considered
Keywords :
encapsulation; failure analysis; high-temperature techniques; integrated circuit packaging; integrated circuit testing; life testing; plastic packaging; 175 C; 200 C; IC plastic encapsulated packages; biphenyl compound; chemistry; cresol novolac; failure analysis; glass transition temperature; high temperature applications; high temperature storage life test; multi-functional compound; over-testing; static operating life test; Application specific integrated circuits; Automotive engineering; Bonding; Glass; Intermetallic; Metallization; Plastic integrated circuit packaging; Plastic packaging; Temperature distribution; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517794
