High temperature applications for IC plastic encapsulated packages

Author

Chen, Andrea S. ; Lo, Randy H Y

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

889

Lastpage

893

Abstract

In this study, comparisons were made between different compound chemistries-cresol novolac, biphenyl, and multifunctional-using the High Temperature Storage Life Test, at 175°C and at 200°C. Static Operating Life Testing at 175°C was also performed on the multi-functional compound. Failure analysis was performed on a sample of the tested units. However, with the testing temperatures above the glass transition temperatures, over-testing may be an issue and must be considered

Keywords

encapsulation; failure analysis; high-temperature techniques; integrated circuit packaging; integrated circuit testing; life testing; plastic packaging; 175 C; 200 C; IC plastic encapsulated packages; biphenyl compound; chemistry; cresol novolac; failure analysis; glass transition temperature; high temperature applications; high temperature storage life test; multi-functional compound; over-testing; static operating life test; Application specific integrated circuits; Automotive engineering; Bonding; Glass; Intermetallic; Metallization; Plastic integrated circuit packaging; Plastic packaging; Temperature distribution; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.517794

Filename

517794