Title :
Time-domain interconnect model generation of Alloy-42 leadframes
Author :
Osorio, Rolando J.
Author_Institution :
Motorola Inc., USA
Abstract :
S-parameter (scattering-parameter) measurements were performed on a 240-lead Alloy-42 leadframe. An interconnect RLCM circuit model is used to optimize around the measured s-parameter file. Optimization is then performed in the frequency-domain until the interconnect model is matched to the measured data. Frequency and time-domain circuit simulations are run to compare the measured leadframe, the existing RLCM lumped circuit model, and the optimized models. While the optimized model waveforms produced show an excellent match with the measured data, the existing RLCM model deviates from the measured data response
Keywords :
S-parameters; circuit analysis computing; circuit optimisation; lumped parameter networks; packaging; time-domain analysis; Alloy-42 leadframes; RLCM lumped circuit model; circuit simulation; optimization; s-parameter measurement; time-domain interconnect model; Capacitance; Circuit simulation; Electrical resistance measurement; Frequency measurement; Integrated circuit interconnections; Lead; Performance evaluation; Plastic packaging; Testing; Time domain analysis;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517795