DocumentCode
2703792
Title
Time-domain interconnect model generation of Alloy-42 leadframes
Author
Osorio, Rolando J.
Author_Institution
Motorola Inc., USA
fYear
1995
fDate
21-24 May 1995
Firstpage
894
Lastpage
899
Abstract
S-parameter (scattering-parameter) measurements were performed on a 240-lead Alloy-42 leadframe. An interconnect RLCM circuit model is used to optimize around the measured s-parameter file. Optimization is then performed in the frequency-domain until the interconnect model is matched to the measured data. Frequency and time-domain circuit simulations are run to compare the measured leadframe, the existing RLCM lumped circuit model, and the optimized models. While the optimized model waveforms produced show an excellent match with the measured data, the existing RLCM model deviates from the measured data response
Keywords
S-parameters; circuit analysis computing; circuit optimisation; lumped parameter networks; packaging; time-domain analysis; Alloy-42 leadframes; RLCM lumped circuit model; circuit simulation; optimization; s-parameter measurement; time-domain interconnect model; Capacitance; Circuit simulation; Electrical resistance measurement; Frequency measurement; Integrated circuit interconnections; Lead; Performance evaluation; Plastic packaging; Testing; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.517795
Filename
517795
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