• DocumentCode
    2703792
  • Title

    Time-domain interconnect model generation of Alloy-42 leadframes

  • Author

    Osorio, Rolando J.

  • Author_Institution
    Motorola Inc., USA
  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    894
  • Lastpage
    899
  • Abstract
    S-parameter (scattering-parameter) measurements were performed on a 240-lead Alloy-42 leadframe. An interconnect RLCM circuit model is used to optimize around the measured s-parameter file. Optimization is then performed in the frequency-domain until the interconnect model is matched to the measured data. Frequency and time-domain circuit simulations are run to compare the measured leadframe, the existing RLCM lumped circuit model, and the optimized models. While the optimized model waveforms produced show an excellent match with the measured data, the existing RLCM model deviates from the measured data response
  • Keywords
    S-parameters; circuit analysis computing; circuit optimisation; lumped parameter networks; packaging; time-domain analysis; Alloy-42 leadframes; RLCM lumped circuit model; circuit simulation; optimization; s-parameter measurement; time-domain interconnect model; Capacitance; Circuit simulation; Electrical resistance measurement; Frequency measurement; Integrated circuit interconnections; Lead; Performance evaluation; Plastic packaging; Testing; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.517795
  • Filename
    517795