Title :
A case study of high pin count area array ceramic package crack
Author :
Ghahghahi, Farshad ; Chung, Tom C.
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
The need for higher circuit density on a integrated circuit (IC) with high pin count requires a large substrate size package to accommodate its wiring. This paper presents issues, approaches, and solutions for a high pin count (447 pins) microprocessor ceramic packaging with a focus on the package cracking. The effects of printed circuit board thickness, package standoff height, and environmental conditions on high pin count ceramic pin grid array (CPGA) package cracking are reviewed and discussed
Keywords :
ceramics; cracks; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; probability; thermal analysis; thermal stresses; PCB thickness; area array ceramic package; ceramic PGA; ceramic package cracking; environmental conditions; high pin count package; integrated circuit; microprocessor ceramic packaging; package standoff height; pin grid array; printed circuit board thickness; Assembly; Ceramics; Computer aided software engineering; Integrated circuit packaging; Pins; Printed circuits; Soldering; Temperature; Tensile stress; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517799
