Title :
Craze and instability of polyimide thin films and its effects on high density interconnects
Author :
Wu, Sean X. ; Yeh, Chao-pin ; Wyatt, Karl ; Pecht, Michael
Author_Institution :
Corp. Manuf. Res. Center, Motorola Inc., Schaumburg, IL, USA
Abstract :
Stress-strain oscillation occurred prior to the appearance of necking deformation in tensile tests of polyimide films. This oscillation appears to be related to initiation and propagation of craze, rather than neck deformation. Both temperature and strain rate have a significant affect on oscillation. The effects of craze initiation and propagation on reliability of high density interconnects are discussed
Keywords :
cracks; crazing; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; polymer films; stability; stress-strain relations; tensile testing; HDI reliability; craze initiation; craze propagation; crazing; high density interconnects; instability; necking deformation; polyimide thin films; strain rate; stress-strain oscillation; tensile tests; Capacitive sensors; Conducting materials; Glass; Optical materials; Polyimides; Polymers; Temperature; Testing; Thermal conductivity; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517800
