Ceramic column grid array for flip chip applications

Author

Master, Raj N. ; Cole, Marie S. ; Martin, Greg B. ; Caron, Alain

Author_Institution

East Fishkill Facility, IBM Microelectron., Hopewell Junction, NY, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

925

Lastpage

929

Abstract

Ceramic Column Grid Array (CCGA) technology was introduced by IBM several years ago. The purpose of the Column Grid Array (CGA) technology was its improved reliability compared to the Ball Grid Array due to height and compliance. This paper describes several process improvements in fabricating the columns onto the substrates. These improvement´s include attaching the columns to the ceramic substrate using no clean flux and the ability to rework cast columns during the fabrication of the module. In addition, stress testing was completed to validate the use of the Coffin-Manson equation in predicting the fatigue life as a function of column length, as well as a bridge between two accelerated thermal cycling (ATC) conditions, 0-100°C and -55-125°C

Keywords

ceramics; fatigue; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; -55 to 125 C; CGA technology; Coffin-Manson equation; accelerated thermal cycling; ceramic column grid array; ceramic substrate; column length; fatigue life prediction; flip chip applications; no clean flux; reliability; stress testing; Bridges; Ceramics; Electronics packaging; Equations; Fabrication; Fatigue; Flip chip; Joining processes; Life testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.517801

Filename

517801