Title :
Ceramic column grid array for flip chip applications
Author :
Master, Raj N. ; Cole, Marie S. ; Martin, Greg B. ; Caron, Alain
Author_Institution :
East Fishkill Facility, IBM Microelectron., Hopewell Junction, NY, USA
Abstract :
Ceramic Column Grid Array (CCGA) technology was introduced by IBM several years ago. The purpose of the Column Grid Array (CGA) technology was its improved reliability compared to the Ball Grid Array due to height and compliance. This paper describes several process improvements in fabricating the columns onto the substrates. These improvement´s include attaching the columns to the ceramic substrate using no clean flux and the ability to rework cast columns during the fabrication of the module. In addition, stress testing was completed to validate the use of the Coffin-Manson equation in predicting the fatigue life as a function of column length, as well as a bridge between two accelerated thermal cycling (ATC) conditions, 0-100°C and -55-125°C
Keywords :
ceramics; fatigue; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; -55 to 125 C; CGA technology; Coffin-Manson equation; accelerated thermal cycling; ceramic column grid array; ceramic substrate; column length; fatigue life prediction; flip chip applications; no clean flux; reliability; stress testing; Bridges; Ceramics; Electronics packaging; Equations; Fabrication; Fatigue; Flip chip; Joining processes; Life testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517801
