Title :
Temperature and stress time history responses in electronic packaging
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
The closed-form thermoelasticity solutions of electronic packages subjected to an instantaneous source of heat, and a heat source varying harmonically as function of time are presented. Useful curves and charts which relate the variables, time, frequency, heat, temperature, stress, displacement, and material property are also provided for engineering practice convenience. Also, the. Present results can be used to verify finite element analysis procedures and interpret experimental data
Keywords :
finite element analysis; packaging; thermal analysis; thermal stresses; thermoelasticity; closed-form thermoelasticity solutions; electronic packaging; finite element analysis; heat source; stress time history response; Electronics packaging; Frequency; History; Poisson equations; Space heating; Temperature distribution; Thermal conductivity; Thermal expansion; Thermal force; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517805
