Title :
Synthesis and characterization of polydopamine modified carbon nanotube (CNT)/polydimethylsiloxane (PDMS) composites
Author :
Chih-Feng Wang ; Pei-Kang Huang ; Pei-Rung Hung ; Chan-Chih Hsu ; Sheng-Rui Jian ; Ping-Feng Yang ; Min-Hua Chung
Author_Institution :
Dept. of Mater. Sci. & Eng., I-Shou Univ., Kaohsiung, Taiwan
Abstract :
Carbon nanotubes (CNTs) have found enormous applicability in most areas of science and engineering because of their excellent electronic and thermal conductivity and mechanical properties. In this study, we prepared polydopamine modified CNT/Polydimethylsiloxane (PDMS) composites with CNTs possessing different lengths to achieve higher thermal conductivity. We used thermal conductivity meter (Hot disk), scanning electron microscope (SEM), thermogravimetric analysis (TGA), and contact angle goniometer to determine the thermal conductivity, morphology, thermal stability, and wettability, respectively, of the CNT/PDMS composites. We founded that the long-CNT/PDMS composite possessed better electronic and thermal conductivity than the short-CNT/PDMS composite. We also founded that the polydopamine modification could enhance hydrophilicity and surface free energy of CNT/PDMS composites.
Keywords :
carbon nanotubes; contact angle; free energy; goniometers; hydrophilicity; materials preparation; nanocomposites; nanofabrication; organic-inorganic hybrid materials; polymers; scanning electron microscopy; surface energy; thermal analysis; thermal conductivity; wetting; CNT-PDMS composite morphology; CNT-PDMS composite thermal stability; CNT-PDMS composite wettability; SEM; TGA; contact angle goniometer; hydrophilicity; polydimethylsiloxane; polydopamine modified CNT-PDMS composites; polydopamine modified carbon nanotube; scanning electron microscopy; surface free energy; thermal conductivity; thermogravimetric analysis; Carbon nanotubes; Conductivity; Polymers; Scanning electron microscopy; Thermal analysis; Thermal conductivity; Thermal stability; formatting; insert; style; styling;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111126