DocumentCode :
2704094
Title :
Harsh military environments and microelectromechanical (MEMS) devices
Author :
Brown, T. Gordon
Author_Institution :
U.S. Army Res. Lab., APG, MD, USA
Volume :
2
fYear :
2003
fDate :
22-24 Oct. 2003
Firstpage :
753
Abstract :
The harsh military environment including operational requirements (temperature, pressure, acceleration and vibration) is described for a few munition applications. A summary of ground based experimentation pertaining to MEMS devices is presented. Results of a high-g shock study suggest that some Microelectromechanical (MEMS) sensors are rugged enough to survive both low-g and high-g launch. Small sensitivities to temperature, shock and vibration are described for a MEMS angular rate sensor. Flight experiments with artillery and rockets instrumented with MEMS angular rate sensors, accelerometers, and telemetry units, were recently completed. Analysis of the angular rate sensor data show encouraging results for surviving and measuring munition pitching and yawing behavior. There is mention of future military applications for MEMS and needed requirements to enable a successful transition.
Keywords :
acceleration measurement; microsensors; missiles; rockets; telemetry; MEMS angular rate sensor; MEMS devices; acceleration; accelerometers; artillery; harsh military environments; high-g shock study; microelectromechanical devices; munition applications; operational requirements; pressure; rockets; telemetry units; temperature; vibration; Acceleration; Electric shock; Instruments; Land surface temperature; Microelectromechanical devices; Micromechanical devices; Rockets; Sensor phenomena and characterization; Temperature sensors; Weapons;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2003. Proceedings of IEEE
Print_ISBN :
0-7803-8133-5
Type :
conf
DOI :
10.1109/ICSENS.2003.1279042
Filename :
1279042
Link To Document :
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